A note on book covers: while we do our best to ensure the accuracy of cover images, ISBNs may at times be reused for different editions of the same title which may hence appear as a different cover.
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation c. by Book News, Inc., Portland, Or.
A note on book covers: while we do our best to ensure the accuracy of cover images, ISBNs may at times be reused for different editions of the same title which may hence appear as a different cover.
Insight into advanced flip chip and interconnect systems.
Who is this book for?
If you're diving into electronics packaging and interconnects, this book offers a detailed exploration of flip chip technologies. It's perfect for engineers and technical managers seeking an in-depth understanding of design choices, material considerations, and quality assurance in high-tech manufacturing processes. Readers have found it invaluable for navigating both current and future advancements all within a comprehensive technical scope.
